Polybenzoxazole precursor, photosensitive resin composition using the same, and manufacturing method of semiconductor device

A photosensitive resin composition comprising:

• a photosensitizer;
• and
• a polybenzoxazole precursor represented by the following formula (1):
• wherein R3a′ and R3b′ may be the same or different, and each of them represents a hydrogen atom or a phenyl group;
• X1 represents a group represented by formula (2) or (3):
• X2 represents a divalent aromatic group, heterocyclic group, alicyclic group, or aliphatic group, each of which may contain a silicon atom;
• X3 represents a tetravalent aromatic group, aliphatic group, heterocyclic group, or mixed group thereof;
• Ra and Rb each independently represents a hydrogen atom, an alkyl group, an acyl group, SO2Rc, a group capable of leaving by the action of an acid, or —C(R3)2—COOR4;
• Rc represents an alkyl group, an aryl group, or an alicyclic group;
• R3 represents a hydrogen atom or an alkyl group having from 1 to 4 carbon atoms;
• R4 represents a group capable of leaving by the action of an acid;
• Y1 represents a divalent aromatic group, aliphatic group, heterocyclic group, or mixed group thereof;
• each groups represented by X1, X2, X3, Y1, Ra, Rb, Rc, R3 and R4 may be the same or different;
• and
• m represents an integer of from 3 to 1,000,
• wherein at least one of the groups represented by X1 and the groups represented by Y1 in the formula (1) comprises a structure represented by the following formula (A2-2):
• wherein M represents a single bond or a divalent group;
• R21 and R22 each independently represents a fluorine atom or a univalent organic group;
• r and s each independently represents an integer of from 1 to 4;
• and
• the addition amount of the polybenzoxazole precursor is from 50 to 99.5 mass % based on the total solids content of the photosensitive resin composition.