Electron gun evaporation apparatus and film formation method using the electron gun evaporation apparatus
AssigneeCanon Anelva Corporation
InventorMasato Nakayama
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Abstract
An electron gun evaporation apparatus capable of efficiently using an evaporation source includes an electron beam position controller which determines, as an applicable range, a range within which the distribution of the film thickness growth rate is almost constant in each scanning direction of an electron beam to be applied to an evaporation source in a crucible for the irradiation position of the electron beam, on the basis of information pertaining to the electron beam irradiation position and the film thickness growth rate in the electron beam irradiation position.
Claims4
An electron gun evaporation apparatus including, in a vacuum chamber configured to be evacuated, an electron gun configured to irradiate an electron beam to an evaporation source and to form a film on a substrate by evaporating the evaporation source by heat of the irradiated electron beam, and electron beam position control means which has a memory and controls said electron gun so as to irradiate the electron beam to a predetermined position of the evaporation source,
- wherein said electron beam position control means (i) stores, in the memory, information concerning an irradiation position of the electron beam and information concerning a film thickness growth rate corresponding to the irradiation position before the electron gun irradiates the electron beam and the evaporation source is evaporated, and (ii) controls, based on the information stored in the memory, the electron gun so as to irradiate the electron beam for forming the film on the substrate in a range within which a distribution of the film thickness growth rate is substantially constant in a scanning direction of the electron beam.
A film formation method using an electron gun evaporation apparatus including, in a vacuum chamber configured to be evacuated, an electron gun which generates an electron beam by accelerating thermions generated from a filament by applying a voltage to the thermions, a film thickness controller which detects a film thickness growth rate of an evaporated film formed on a substrate by applying the electron beam to an evaporation source and evaporating the evaporation source by heat, and a sweep controller which controls an irradiation position of the electron beam on the evaporation source, the film formation method using the electron gun evaporation apparatus comprises:
- an acquisition step of acquiring information concerning an irradiation position of the electron beam from the sweep controller, and information concerning a film thickness growth rate corresponding to the irradiation position from the film thickness controller;
- an electron beam position control step of determining an applicable range within which the electron beam can be applied to the evaporation source, on the basis of the information concerning an irradiation position of the electron beam acquired in the acquisition step, and the information concerning a film thickness growth rate corresponding to the irradiation position, and storing the applicable range in a memory;
- and
- an evaporation step of depositing an evaporated film on the substrate by applying the electron beam to the evaporation source and evaporating the evaporation source by heat, within the applicable range determined in the electron beam position control step;
- wherein in the electron beam position control step, a range within which a distribution of the film thickness growth rate is substantially constant in each scanning direction of the electron beam is determined as the applicable range, on the basis of the information concerning an irradiation position of the electron beam, and the information concerning a film thickness growth rate corresponding to the irradiation position.
Dependencies are inferred from the claim text.