Biochip package and biochip packaging substrate
AssigneeSamsung Electronics Co., Ltd.
InventorsJune-Young Lee, Dong-Ho Lee
Life of this patent
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Abstract
A biochip package allowing biochips optimized for high-volume production to be compatible with general-purpose devices and a biochip packaging substrate of the biochip package are provided. The biochip package can include a biochip having a probe array mounted thereon and a biochip packaging substrate on which the biochip is mounted and which has a through cavity exposing a rear surface of the biochip.
Claims24
A biochip package comprising:
- a biochip mounted on a biochip packaging substrate, wherein the biochip packaging substrate comprises a through cavity exposing a portion of a rear surface of the biochip;
- and
- a probe array mounted on the biochip,
- wherein the biochip has a top surface on which the probe array is formed, and wherein the top surface is opposite to the rear surface.
A biochip packaging substrate on which a biochip is mounted and comprising a through cavity exposing a rear surface of the biochip, wherein the biochip has a top surface on which a probe array is formed, and wherein the top surface is opposite to the rear surface.
Dependencies are inferred from the claim text.