Physical vapor deposition with multi-point clamp

A method of physical vapor deposition comprising:

• positioning a substrate on a chuck in a physical vapor deposition apparatus, the physical vapor deposition apparatus including:
• a vacuum chamber having side walls;
• a cathode inside the vacuum chamber, wherein the cathode includes a sputtering target;
• an anode inside and electrically connected to the side walls of the vacuum chamber;
• a chuck inside and electrically isolated from the side walls of the vacuum chamber, the chuck supporting a substrate;
• a clamp holding the substrate to the chuck, wherein the clamp is electrically conductive;
• and
• a plurality of conductive electrodes attached to the clamp, each electrode each electrode of the plurality of conductive electrodes having a first end attached to the clamp and an unattached second end, each electrode configured to compress when contacted by the substrate, and when contacted by the substrate, the unattached second end of at least one of the conductive electrodes is pressed against the clamp;
• wherein the substrate is positioned on the chuck and in contact with each of the plurality of electrodes, the contact causing each of the plurality of electrodes to compress;
• applying a radio frequency signal to the cathode;
• and
• depositing material from the sputtering target onto the substrate such that film having a substantially pure (100) crystalline structure is formed.