Stack structure and method of manufacturing the same
AssigneeCasio Computer Co., Ltd.
InventorsTsutomu Terazaki, Osamu Nakamura, Keishi Takeyama, Masatoshi Nomura
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Abstract
A stack structure is formed by stacking and bonding a plurality of substrates. The stack structure includes bonding films each of which is interposed in a bonding region between, adjacent glass substrates, and bonded to oxygen atoms in the glass of the substrate by anodic bonding.
Claims11
A method of manufacturing a stack structure provided with a plurality of substrates including at least a first substrate, a second substrate including glass, and a third substrate, the method comprising:
- applying a first electric field acting in a direction between the first and second substrates to bond a first bonding film located between one surface of the first substrate and one surface of the second substrate to oxygen atoms in the glass in the second substrate, and to effect anodic bonding of the first and second substrates to each other in such a manner as to incorporate alkali components in the glass in the second substrate into a first buffer film provided on the other surface of the second substrate;
- and
- applying a second electric field acting in the same direction as the first electric field, between the second substrate and the third substrate, the third substrate including glass, to bond a second bonding film which is located between the other surface of the second substrate and one surface of the third substrate, to oxygen atoms in the glass of the third substrate, and to effect anodic bonding of the second and third substrates in such a manner as to incorporate alkali components in the glass of the third substrate into a second buffer film provided on the other surface of the third substrate.
A method of manufacturing a stack structure provided with a plurality of substrates, the method comprising:
- bonding a first substrate, which is included in the plurality of substrates and which comprises one of silicon and glass, to oxygen atoms in glass in a second substrate included in the plurality of substrates, and effecting anodic bonding between the first and second substrates in such a manner as to incorporate alkali components in the glass in the second substrate into a first buffer film provided on a surface of the second substrate to which the first substrate is not bonded, the bonding being performed by applying a first electric field acting in a direction between the first and second substrates;
- and
- bonding a bonding film provided between the second substrate and a third substrate, which is included in the plurality of substrates and which comprises glass, to oxygen atoms in the glass in the third substrate, by applying a second electric field acting in the same direction as the first electric field, between the second and third substrates, and effecting anodic bonding between the second and third substrates in such a manner as to incorporate alkali components in the glass in the third substrate into a second buffer film provided on a surface of the third substrate to which the second substrate is not bonded.
Dependencies are inferred from the claim text.