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US 8,133,329 B2Granted
Selective sintering of compacted components
AssigneeGM Global Technology Operations LLC
InventorShekhar G. Wakade
Life of this patent
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Abstract
One embodiment includes compacting a powder material using at least a first magnetic field to form a compact and selectively sintering a first portion of the compact and leaving a second portion of the compact unsintered to form a component.
Claims17
A method comprising:
- compacting a powder material comprising compressing the powder material by subjecting the powder material to at least a first magnetic field to form a compact;
- and
- selectively sintering a first portion of the compact and leaving a second portion of the compact unsintered to form a component.
A method comprising:
- providing a powder material and a substrate overlying the powder material;
- subjecting the powder material and the substrate to an electromagnetic field to compress the substrate to compact the powder material into a compact;
- and
- selectively sintering a first portion of the compact and leaving a second portion of the compact unsintered to form a component.
1 more element
A method comprising:
- compacting a powder material using at least a first magnetic field to form a compact comprising providing an electrically conductive container and placing the powder material in the container and wherein the first magnetic field induces a current in the container producing a second magnetic field so that the first and second magnetic fields repel each other and the container is compressed to compact the powder material to provide a compact, and thereafter selectively sintering a first portion of the compact and leaving a second portion of the compact unsintered to form a component comprising a first sintered portion and a second unsintered portion.
Dependencies are inferred from the claim text.