US 8,133,096 B2 · Multi-phase polishing pad

Abstract

An article of manufacture, a method, and an apparatus for use in a chemical mechanical polishing system is provided. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a polishing surface, the polishing surface including a first polishing portion having a first polishing material of a first hardness for polishing a first portion of the substrate, and a second polishing portion having a second polishing material of a second hardness for polishing a second portion of the substrate. The article of manufacturer may be disposed on a rotatable, stationary, or linear platen for processing a substrate. In another aspect, a method is provided for processing a substrate, including providing a platen containing the polishing article disposed on the rotatable platen, delivering a polishing composition to the polishing article, and contacting a substrate on the polishing article.

Claims23

Dependent claims

An article for polishing a substrate, comprising:

a polishing pad having a substrate polishing surface, the polishing pad comprising:
a first polishing material having a first hardness and defining an outer portion of the substrate polishing surface;
and
a second polishing material having a second hardness and defining a center portion of the substrate polishing surface, the second polishing material having a hardness different than a hardness of the first polishing material, wherein the first hardness is less than the second hardness and the second hardness is about 50 or higher on the Shore D hardness scale.

1 more element

Dependencies are inferred from the claim text.

Multi-phase polishing pad

Life of this patent

Multi-phase polishing pad

Life of this patent

Abstract

Claims23