Light emitting diode substrate module and method of manufacturing the same, and backlight unit and method of manufacturing the same

A method of manufacturing a light emitting diode substrate module, the method comprising:

• forming an insulating film having a predetermined thickness on an entire surface of a metal plate;
• forming a reflective film having a predetermined thickness on an entire surface of the insulating film;
• and
• forming a driving circuit on an outer surface of the reflective film by pattern printing and electrically connecting the driving circuit to at least one light emitting diode package,
• wherein the forming a driving circuit on an outer surface of the reflective film by pattern printing comprises forming a circuit protection film formed of porcelain enamel, the circuit protection film being configured on the driving circuit so as to enable an external electrode electrically connected to the light emitting diode package to be exposed to the outside.

A backlight unit comprising:

• a metal chassis having a mounting part recessed to a predetermined depth;
• an insulating film having a predetermined thickness and provided on an entire outer surface of the metal chassis;
• a reflective film having a predetermined thickness and provided on the insulating film corresponding to the recess;
• and
• at least one light emitting diode package electrically connected to a driving circuit formed on the reflective film or the insulating film by pattern printing,
• wherein the reflective film further comprises a circuit protection film formed of porcelain enamel, the circuit protection film being configured on the driving circuit so as to enable an external electrode electrically connected to the light emitting diode package to be exposed to the outside.

A method of manufacturing a backlight unit, the method comprising:

• providing a metal chassis having a mounting part recessed to a predetermined depth;
• forming an insulating film having a predetermined thickness on an entire outer surface of the metal chassis;
• forming a reflective film having a predetermined thickness on the insulating film corresponding to the recess;
• and
• forming a driving circuit on the reflective film by pattern printing and electrically connecting at least one light emitting diode package to the driving circuit,
• wherein the forming a driving circuit on the reflective film by pattern printing comprises exposing an external electrode electrically connected to the light emitting diode package to the outside porcelain applied to the reflective film, and then firing the circuit protection film and the driving circuit.