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US 8,132,893 B2Granted
Printhead assembly with molded ink manifold having polymer coating
AssigneeSilverbrook Research Pty Ltd
InventorsSeung Jin Lee, Susan Williams, Jan Waszczuk, Kia Silverbrook
Life of this patent
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Abstract
A printhead assembly includes: a molded ink manifold having a plurality of ink outlets defined in a manifold bonding surface; and printhead integrated circuits bonded to the manifold bonding surface. The manifold bonding surface includes a polymer coating, which plugs fissures in the molded ink manifold.
Claims10
A printhead assembly comprising:
- a molded ink manifold having a plurality of ink outlets defined in a manifold bonding surface;
- one or more printhead integrated circuits bonded to the manifold bonding surface,
- wherein at least said manifold bonding surface comprises a polymer coating, said polymer coating plugging fissures in said molded ink manifold.
Dependencies are inferred from the claim text.