Solder mold plates used in packaging process and method of manufacturing solder mold plates
AssigneeInternational Business Machines Corporation
InventorLewis S Goldmann
Life of this patent
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Abstract
Solder mold plates and methods of manufacturing the solder mold plates are provided herein. The solder mold plates are used in controlled collapse chip connection processes. The solder mold plate includes a plurality of cavities. At least one cavity of the plurality of cavities has a different volume than another of the cavities in a particular chip set site. The method of manufacturing the solder mold plate includes determining susceptible white bump locations on a chip set. The method further includes forming lower volume cavities on the solder mold plate which coincide with the susceptible white bump locations, and forming higher volume cavities on the solder mold plate which coincide with less susceptible white bump locations.
Claims14
A solder mold plate comprising a plurality of cavities, wherein:
- at least one cavity of the plurality of cavities has a different volume than another of the cavities in a particular chip set site;
- the at least one cavity coincides with locations on a chip that are susceptible to white bump damage;
- the at least one cavity is two or more cavities which each having a reduction in volume of about 30% to about 35% in comparison to the another of the cavities;
- and
- the two or more cavities is a plural amount of cavities which do not exceed about 5% to 10% of a total amount of the plurality of cavities.
A solder mold plate comprising a plurality of cavities, wherein:
- at least one cavity of the plurality of cavities has a different volume than another of the cavities in a particular chip set site;
- the at least one cavity coincides with locations on a chip that are susceptible to white bump damage;
- the at least one cavity is two or more cavities which have a gradual decrease in volume gradation towards edges of the solder mold plate;
- a volume degradation across the solder mold plate is a maximum of about 15% to about 20% volume reduction;
- and
- the about 15% to 20% volume reduction is offset by about 15% to 20% increase in volume in at least one of the another cavities.
A solder mold plate, comprising:
- a mold plate with a plurality of cavities for molding solder;
- lower volume cavities formed in at least a first location on the solder mold plate coinciding with areas that are susceptible to wiring delamination;
- and
- higher volume cavities formed near and at a center of the solder mold plate,
- wherein:
- the plurality of cavities comprise the lower volume cavities and the higher volume cavities;
- the location in which the lower volume cavities and the higher volume cavities are formed in the mold plate are determined such that the lower volume cavities coincide with the areas of a chip set that are susceptible to wiring delamination and the higher volume cavities coincide with areas of the chip set that are less susceptible to wiring delamination;
- the lower volume cavities each having a reduction in volume of about 30% to about 35% in comparison to the higher volume cavities, the reduction in volume is based on a calculation for a 3-on-6 solder bump;
- the lower volume cavities do not exceed about 5% to 10% of a total amount of the plurality of cavities;
- each one of the plurality of cavities has a rounded, semi-circular shape;
- and
- the mold plate and the plurality of cavities are configured such that high volume solder bumps formed by the higher volume cavities are squeezed down from their spherical heights, and lower volume solder bumps formed by the lower volume cavities are stretched up due to surface tension imposed by a substrate and a chip.
Dependencies are inferred from the claim text.