Semiconductor device and method for manufacturing same
AssigneeNichia Corporation
InventorsTadao Hayashi, Yoshiharu Nagae
Life of this patent
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Abstract
A semiconductor device comprises a semiconductor element having electrodes, a metal member, wires that electrically connect the semiconductor element and the metal member and/or electrodes within the semiconductor element, wherein the wires constitute at least a first wire loop and a second wire loop, the first wire loop is bonded at one end to a first bonding point and at the other end to a second bonding point, and has a flat part which includes the surface of a boll part and the wire located contiguously the ball part surface, and the second wire loop connects the surface of the ball part and a third bonding point.
Claims16
A semiconductor device comprising
- a semiconductor element having electrodes, a metal member, wires that electrically connect the semiconductor element and the metal member, and/or electrodes within the semiconductor element,
- wherein the wires constitute at least a first wire loop and a second wire loop,
- the first wire loop is bonded at one end to a first bonding point by ball bonding and at the other end to a second bonding point, the first wire loop having a flat part formed at the first bonding point by flattening a part of a ball part and a loop of the wire drawn from the ball part toward an opposite side of the second bonding point, and
- the second wire loop is bonded at one end to a third bonding point by ball compression bonding and at the other end to the flat part of the first wire loop at the first bonding point, the wire bonding at the third bonding point and at a flat part of the first wire loop at the first bonding point being compression bonded, a second ball formed by the melting of the wire at the third bonding point, a loop of the wire drawn from the second ball toward an opposite direction of the first bonding point with the loop extending from the second ball over and onto the second ball and being further compression bonded to the second ball, the wire being drawn toward the first bonding point, and bonded to the first bonding point.
A method for manufacturing a semiconductor device having a semiconductor element having electrodes, a metal member, wires that electrically connect the semiconductor element and the metal member and/or electrodes within the semiconductor element, the wires constituting at least a first wire loop and a second wire loop, the first wire loop being bonded at one end to a first bonding point and at the other end to a second bonding point, and having a flat part which includes the surface of a ball part and the wire located contiguously the ball part surface, and the second wire loop connecting the surface of the ball part and a third bonding point, comprising the steps of:
- (a) compression bonding a ball formed by the melting of the wire to the first bonding point, forming a loop of the wire by drawing the wire from the ball toward an opposite direction of the second bonding point, further compression bonding the loop of the wire extending from the ball onto the ball to flatten a part of the ball, drawing the wire toward the second bonding point, and bonding it to the second bonding point;
- and
- (b) wire bonding the third bonding point and a flat part of the first wire loop at the first bonding point by compression bonding a ball formed by the melting of the wire to the third bonding point, forming a loop of the wire by drawing the wire from the ball toward an opposite direction of the first bonding point, further compression bonding the loop of the wire extending from the ball onto the ball, drawing the wire toward the first bonding point, and bonding it to the first bonding point.
A method for manufacturing a semiconductor device having a semiconductor element having electrodes, a metal member, wires that electrically connect the semiconductor element and the metal member and/or electrodes within the semiconductor element, the wires constituting at least a first wire loop and a second wire loop, the first wire loop being bonded at one end to a first bonding point and at the other end to a second bonding point, and having a flat part which includes the surface of a ball part and the wire located contiguously the ball part surface, and the second wire loop connecting the surface of the ball part and a third bonding point, comprising the steps of:
- (a) compression bonding a ball formed by the melting of the wire to the first bonding point, forming a loop of the wire by drawing the wire from the ball toward an opposite direction of the second bonding point, further compression bonding the loop of the wire extending from the ball onto the ball to flatten a part of the ball, drawing the wire toward the second bonding point, and bonding it to the second bonding point;
- and
- (b) wire bonding the third bonding point and a flat part of the first wire loop at the first bonding point by compression bonding a ball formed by the melting of the wire to the first bonding point, then further compression bonding another part of the wire extending from the ball onto the ball, drawing the wire toward the third bonding point, and bonding it to the third bonding point.
Dependencies are inferred from the claim text.