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US 8,132,305 B2Granted
Equipment and method for cutting package
AssigneeSamsung Electronics Co., Ltd.
InventorsTai-Kew Choi, Yong-Kyun Sun, Hee-Sang Yang, Yo-Se Eum, Ho-Soo Jang
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Abstract
A package cutting apparatus includes at least two spindles installed at a sawing robot and cutting a frame including a plurality of packages into packages using cutting bits; a frame loading jig loading the frame so that the frame is cut; and a frame-and-unit picker installed at an orthogonal robot to load and unload the frame on and from the frame loading jig, wherein a state of the cutting bit installed at the spindle is checked.
Claims28
A package cutting apparatus, comprising:
- a sawing robot;
- a plurality of spindles coupled to the sawing robot;
- a plurality of cutting bits coupled to the plurality of spindles for cutting a package from a frame during a cutting process;
- a frame loading jig for supporting the frame during the cutting process;
- a further robot;
- a frame-and-unit picker coupled to the further robot for loading and unloading a frame onto and off from the frame loading jig;
- and
- a first sensor for checking a state of one of the plurality of cutting bits coupled to a corresponding one of the plurality of spindles,
- wherein one of the plurality of cutting bits is a two-step router bit having a first cutting portion of a first diameter and a second cutting portion of a second different diameter, the apparatus including two-step router-cutting circuitry adapted to automatically control a router cutting operation with the two-step router bit such that the first cutting portion router-cuts a straight line along the package and the second cutting portion router-cuts a curved line along the package.
6 more elements
Dependencies are inferred from the claim text.