Composite semiconductor device, print head and image forming apparatus

A composite semiconductor device formed of a semiconductor wafer having a plurality of device-forming areas in which semiconductor elements are formed and dicing areas defined between said device-forming areas, and formed by dicing said semiconductor wafer at said dicing areas,

• said composite semiconductor device comprising:
• a semiconductor substrate, and
• a plurality of wiring layers layered on said semiconductor substrate, said wiring layers including at least conductive films,
• wherein connecting portions are formed to connect said wiring layers with each other in a layering direction of said wiring layers, each of said connecting portions being disposed on a device-forming area side with respect to a dicing position defined in said dicing area, and
• wherein ends of said wiring layers are arranged in accordance with an angle at which said semiconductor wafer is diced, each of said ends being disposed on said device-forming area side with respect to said dicing position.