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US 8,129,711 B2Granted
Nitride semiconductor light emitting device and fabrication method thereof
AssigneeSamsung LED Co., Ltd.
InventorsSang Won Kang, Yong Chun Kim, Dong Hyun Cho, Jeong Tak Oh, Dong Joon Kim
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Abstract
The present invention relates to a GaN based nitride based light emitting device improved in Electrostatic Discharge (ESD) tolerance (withstanding property) and a method for fabricating the same including a substrate and a V-shaped distortion structure made of an n-type nitride semiconductor layer, an active layer and a p-type nitride semiconductor layer on the substrate and formed with reference to the n-type nitride semiconductor layer.
Claims8
A nitride semiconductor light emitting device comprising:
- a substrate;
- an n-type semiconductor layer formed on the substrate;
- an active layer formed on the n-type semiconductor layer;
- a p-type semiconductor layer formed on the active layer;
- a transparent electrode formed on the p-type semiconductor layer;
- an n-type electrode formed on an exposed portion of the n-type semiconductor layer;
- and
- p-type bonding electrode formed on the transparent electrode,
- wherein at least one of the n-type semiconductor layer and the p-type semiconductor layer further includes a super lattice layer or a multi-stacked layer;
- and
- a V-shaped distortion structure is formed at least one portion of the active layer and the p-type semiconductor layer with reference to the n-type semiconductor layer,
- wherein the p-type nitride semiconductor layer comprises a hole injection layer formed on the active layer and a p-type contact layer formed on the hole injection layer,
- the V-shaped distortion structure is filled in an area between the p-type contact layer and the active layer, so that the lower surface of the p-type contact layer is flat, and
- the upper and lower surfaces of the active layer in the V-shaped distortion are bent towards the n-type nitride semiconductor layer, respectively.
11 more elements
Dependencies are inferred from the claim text.