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US 8,128,202 B2Granted
Nozzle plate, method for manufacturing nozzle plate, droplet discharge head, and droplet discharge device
AssigneeSeiko Epson Corporation
InventorsYasuhide Matsuo, Kenji Otsuka, Kazuo Higuchi, Kosuke Wakamatsu
Life of this patent
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Abstract
A nozzle plate includes: a nozzle for discharging a liquid as droplets; a liquid-repellent film suppressing attachment of the droplets on one surface of the nozzle plate; and a first bonding film formed on the other surface of the nozzle plate and bonded with a substrate. In the nozzle plate, the liquid-repellent film includes a first plasma polymerized film having a Si skeleton, which includes a siloxane (Si—O) bond and has a random atomic structure, and an elimination group bonded with the Si skeleton.
Claims29
A nozzle plate, comprising:
- a nozzle for discharging a liquid as droplets;
- a liquid-repellent film suppressing attachment of the droplets on one surface of the nozzle plate;
- and
- a first bonding film formed on the other surface of the nozzle plate and bonded with a substrate,
- wherein the liquid-repellent film includes a first plasma polymerized film having a Si skeleton, the Si skeleton including a siloxane (Si—O) bond and having a random atomic structure, and an elimination group bonded with the Si skeleton,
- wherein the elimination group existing around a surface of the first plasma polymerized film is eliminated from the Si skeleton by applying energy to a region of at least a part of the first plasma polymerized film so as to generate reactivity, on the region of the first plasma polymerized film, with a coupling agent having liquid repellency with respect to the droplets, and the first plasma polymerized film is bonded with the coupling agent by the reactivity so as to form the liquid-repellent film,
- wherein the first bonding film is a second plasma polymerized film having a Si skeleton, the Si skeleton including a siloxane (Si—O) bond and having a random atomic structure, and an elimination group bonded with the Si skeleton, and
- wherein the elimination group existing around a surface of the second plasma polymerized film constituting the first bonding film is eliminated from the Si skeleton by applying energy to a region of at least a part of the second polymerized film, so as to develop in the region of the surface of the second polymerized film adhesiveness with respect to the substrate.
5 more elements
Dependencies are inferred from the claim text.