Method for mounting an electronic component on a substrate

A process for assembling a flexible transponder including at least one electronic component made up of a chip provided with contacts on one of the faces of the chip, said contacts being set off on a conductive film constituting fiat conductive areas that extend the

• contacts of the chip in a plane over the chip, comprising:
• placing a first substrate on a work surface, placing the chip of the electronic component into a cavity of the first substrate, the conductive areas of the electronic component being applied against the surface of the first substrate, and
• assembling the first substrate provided with the electronic component on a second substrate provided with conductive tracks, so that the conductive areas of the electronic component applied against the surface of the first substrate connect to the conductive tracks of the second substrate, wherein the conductive areas of the electronic component and the conductive tracks of the second substrate are in contact to achieve a permanent electric connection via a pressure of application of the second substrate on the electronic component, and after the assembling, the conductive areas of the electronic component and the conductive tracks of the second substrate are configured to rub together when repeated stresses are exerted on the substrates.

A process for assembling a flexible transponder including at least one electronic component made up of a module including a set of fiat contacts on one of the faces of the module, each contact of the set being linked with a contact area on the opposite face, comprising:

• placing a first substrate on a work surface, placing the chip of the electronic component into a cavity provided with a window cut into a first substrate, the set of flat contacts shows on the surface level of said first substrate, and
• assembling the first substrate provided with the electronic component on a second substrate provided with conductive tracks, so that the conductive areas of the opposite face of the electronic component connect to the conductive tracks of the second substrate, wherein the conductive areas of the electronic component and the conductive tracks of the second substrate are in contact to achieve a permanent electric connection via a pressure of application of the second substrate on the electronic component, and after the assembling, the conductive areas of the electronic component and the conductive tracks of the second substrate are configured to rub together when repeated stresses are exerted on the substrates.