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US 8,127,647 B2Granted
Protective tape cutting method for semiconductor wafer and device of the same
AssigneeNitto Denko Corporation
InventorsNaoki Ishii, Masayuki Yamamoto
Life of this patent
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Abstract
A cutter blade is relatively moved along an outer periphery of a semiconductor wafer, and dust generated at a tape cutting site by the cutter blade and attached to an upper surface of the protective tape is collected with a dust collecting member which relatively moves with the cutter blade with respect to the semiconductor wafer, and the dust collected at a predetermined portion is suctioned and removed with a suction nozzle after the completion of tape cutting.
Claims9
A method for cutting a protective tape joined to a semiconductor wafer along an outer shape of the semiconductor wafer;
- the method comprising the steps of:
- relatively moving a cutter blade along an outer periphery of the semiconductor wafer, and collecting dust generated at a tape cutting site by the cutter blade and attached to an upper surface of the protective tape with a dust collecting member which relatively moves with the cutter blade with respect to the semiconductor wafer;
- and
- suctioning and removing the dust collected at a predetermined position with the dust collecting member with a suction device after completion of tape cutting.
1 more element
Dependencies are inferred from the claim text.