Method of making bondable flexible printed circuit

A method of making a bondable flexible printed circuit, said method comprising the steps of:

• providing a non-conductive substrate;
• applying to said substrate at least one conductive wet dispersion layer containing carbon nanotubes, larger diameter conductive particles having at least one dimension of at least 100 nanometers which are not carbon nanotubes, and a polymer to form a conductor of a not cured printed circuit;
• curing said not cured printed circuit with heat so that said polymer is cured to form a surface, the cured printed circuit having said carbon nanotubes oriented in a three-dimensional matrix with said larger conductive particles, with at least a portion of said carbon nanotubes protruding above said cured polymer surface;
• and
• bonding a second conductor to said carbon nanotubes protruding from said cured polymer surface.