Wiring substrate, method of manufacturing wiring substrate, and electronic apparatus
AssigneeSeiko Epson Corporation
InventorToshiki Hara
Life of this patent
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Abstract
A method of manufacturing a wiring substrate includes the steps of bonding a first substrate, which includes a pixel area and a drive area located around the pixel area, and is provided with a protruding section formed in the pixel area, to a second substrate on which a peripheral circuit is disposed, so that the peripheral circuit faces the drive area, and separating the second substrate from the first substrate while leaving the peripheral circuit on the first substrate. In the step of bonding the first and the second substrates, the peripheral circuit is pressure-bonded to the first substrate, and the protruding section is made abut on the second substrate in the pixel area.
Claims9
A method of manufacturing a wiring substrate, comprising:
- bonding a first substrate to a second substrate, the first substrate including a drive area and a plurality of pixel electrodes forming a pixel area, the drive area being located outside the pixel area, the first substrate being provided with at least one protruding section formed within the pixel area, a peripheral circuit being disposed on the second substrate such that the peripheral circuit faces the drive area of the first substrate, the at least one protruding section being located outside the peripheral circuit in plan view;
- and
- separating the second substrate from the at least one protruding section of the first substrate while leaving the peripheral circuit on the first substrate,
- the at least one protruding section abutting the second substrate when bonding the first substrate to the second substrate, and
- the peripheral circuit being pressure-bonded to the first substrate.
Dependencies are inferred from the claim text.