# US 8,125,788 B2 · Circuit module and radio communications equipment, and method for manufacturing circuit module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,125,788 B2 - Document ID: US8125788B2 - Status: Granted - Kind: B2 - Application number: 12/293,110 - Filed: 2007-03-29 - Published: 2009-04-09 - Granted: 2012-02-28 - Earliest claimed: 2006-03-29 - Assignees: KYOCERA Corporation - Inventors: Hidefumi Hatanaka; Kaoru Matsuo - Web page: https://patentgrep.com/patent/US8125788B2 ## CPC - H10W 90/00: Package configurations - H03H 9/0542: {consisting of a lateral arrangement (H03H9/0566 takes precedence)} - H03H 9/0547: {consisting of a vertical arrangement (H03H9/0566 takes precedence)} - H03H 9/1021: {the BAW device being of the cantilever type} - H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation} - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 2201/09972: Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently - H05K 2201/10492: Electrically connected to another device - H10W 44/248: {for antennas} - H10W 70/63: Vias, e.g. via plugs - H10W 72/0198: {batch processes} - H10W 72/877: {Bump connectors and die-attach connectors} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - Y10T 29/49137: Different components - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract An electronic component 3 with a shielding function whose upper surface is held at a reference potential, an electronic component 13, and a semiconductor component 4 are mounted on a wiring board 2, and are covered with an insulating resin portion 5 while a conductive layer 6 is formed on an upper surface of the insulating resin portion 5. The conductive layer 6 is held at the reference potential by being connected to a portion, which is held at the reference potential, of the electronic component 3 with a shielding function exposed from the insulating resin portion 5. There can be provided a small-sized circuit module superior in an electromagnetic shielding function. ## Claims ### Claim 1 A circuit module comprising: a wiring board; a plurality of electronic components that are mounted on the wiring board; a reference potential portion that is provided on an upper surface of at least one of the plurality of electronic components; an insulating resin portion that covers the plurality of electronic components, excluding the reference potential portion; and a conductive layer that is connected to the reference potential portion and covers an upper surface of the insulating resin portion, wherein at least one electronic component having the reference potential portion includes a metal plate fixed to its upper surface, and the conductive layer is connected to the metal plate, wherein the electronic component having the reference potential portion includes a container, the metal plate fixed to an upper surface of the container, a piezoelectric vibration element contained in the container, and wherein the metal plate is connected to the ground terminal through wiring of the container. ### Claim 2 (depends on 1) The circuit module according to claim 1, wherein the height of at least one of the electronic components that is provided with the reference potential portion is more than the respective heights of the other electronic components. ### Claim 3 (depends on 2) The circuit module according to claim 2, wherein the height of the upper surface of the insulating resin portion and the height of the electronic component having the reference potential portion are equal to each other. ### Claim 4 (depends on 1) The circuit module according to claim 1, wherein the conductive layer adheres to a side surface of the metal plate, and the height of an upper surface of the conductive layer and the height of the electronic component having the reference potential portion are equal to each other. ### Claim 5 (depends on 1) The circuit module according to claim 1, wherein the conductive layer is formed of a metal sintered layer formed by heating an organic solvent including metal particles having an average particle diameter of 1 nm to 100 nm. ### Claim 6 A circuit module comprising: a wiring board; a plurality of electronic components that are mounted on the wiring board; a reference potential portion that is provided on an upper surface of at least one of the plurality of electronic components; an insulating resin portion that covers the plurality of electronic components, excluding the reference potential portion; and a conductive layer that is connected to the reference potential portion and covers an upper surface of the insulating resin portion, wherein at least one of the electronic components that is provided with the reference potential portion is a semiconductor component including a semiconductor board, a through conductor that penetrates the semiconductor board in the thickness direction, and an electrode pad for a reference potential formed on a lower surface of the semiconductor board and electrically connected to the through conductor, and the reference potential portion is a portion, which is led out to an upper surface of the semiconductor board, of the through conductor. ### Claim 7 (depends on 6) The circuit module according to claim 6, wherein the height of the semiconductor component is more than the respective heights of the other electronic components. ### Claim 8 (depends on 7) The circuit module according to claim 7, wherein the height of the upper surface of the insulating resin portion and the height of the semiconductor component are equal to each other. ### Claim 9 (depends on 6) The circuit module according to claim 6, wherein the conductive layer is formed of a metal sintered layer formed by heating an organic solvent including metal particles having an average particle diameter of 1 nm to 100 nm. ### Claim 10 A circuit module comprising: a wiring board; a plurality of electronic components that are mounted on the wiring board; a reference potential portion that is provided on an upper surface of at least one of the plurality of electronic components; an insulating resin portion that covers the plurality of electronic components, excluding the reference potential portion; and a conductive layer that is connected to the reference potential portion and covers an upper surface of the insulating resin portion, wherein the plurality of electronic components include a first semiconductor component and a second semiconductor component, the insulating resin portion positioned between the first semiconductor component and the second semiconductor component is provided with a groove that separates both the semiconductor components, a shielding member composed of a conductive material is buried in the groove, and the shielding member is electrically connected to the conductive layer. ### Claim 11 (depends on 10) The circuit module according to claim 10, wherein the first semiconductor component is an RFIC, and the second semiconductor component is a baseband IC. ### Claim 12 (depends on 11) The circuit module according to claim 11, further comprising an electronic component for RF electrically connected to the RFIC, wherein the electronic component for RF is arranged in one, where the RFIC is disposed, of two regions separated by the shielding member. ### Claim 13 (depends on 11) The circuit module according to claim 11, wherein a bottom surface of the groove is positioned within the wiring board, and a passive component for RF is contained in the wiring board. ### Claim 14 (depends on 10) The circuit module according to claim 10, wherein the conductive layer and the shielding member are composed of the same material.