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US 8,123,597 B2Granted
Polishing pad
AssigneeBestac Advanced Material Co., Ltd.
InventorsAllen Chiu, Shao-Yu Chen, Yu-Lung Jeng
Life of this patent
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AssigneeBestac Advanced Material Co., Ltd.
InventorsAllen Chiu, Shao-Yu Chen, Yu-Lung Jeng
Estimating the term…
The polishing pad includes a polishing surface, on which is formed with a plurality of first grooves and a plurality of second grooves, wherein the characteristic of the polishing pad is in that: the first grooves are connected to the second grooves, the width of first grooves are larger than that of the second grooves, the depth of first grooves are larger than that of the second grooves, the density of first grooves are larger than that of the second grooves, and the first grooves and the second grooves are uniformly distributed over the polishing surface respectively. Therefore when the polishing step is performed using the polishing pad, smaller scraps produced after polishing or smaller polishing particles in the slurry or more turbid slurry can flow out of the polishing pad via the second groove, and larger scraps or particles can flow out of the polishing pad via the first groove.
A polishing pad, said polishing pad including a polishing surface, a plurality of first grooves and a plurality of second grooves being formed on said polishing surface, wherein characteristic of said polishing pad being in that:
A polishing pad, said polishing pad including a polishing surface, a plurality of first grooves and a plurality of second grooves in grid pattern being formed on said polishing surface, wherein characteristic of said polishing pad being in that:
Dependencies are inferred from the claim text.