# US 8,123,111 B2 · Production method of solder circuit board

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- Number: US 8,123,111 B2
- Document ID: US8123111B2
- Status: Granted
- Kind: B2
- Application number: 11/910,256
- Filed: 2006-03-28
- Published: 2009-03-05
- Granted: 2012-02-28
- Earliest claimed: 2005-03-29
- Assignees: Showa Denko K.K.
- Inventors: Takashi Shoji; Takekazu Sakai; Tetsuo Kubota
- Web page: https://patentgrep.com/patent/US8123111B2

## CPC

- H05K 3/3485: Application of solder paste, slurry or powder (using printing techniques to form the desired conductive pattern of the printed circuit by applying conductive material H05K3/12)
- B23K 1/0016: {Soldering of electronic components}
- B23K 3/06: Solder feeding devices; Solder melting pans
- B23K 2101/42: Printed circuits
- H05K 2203/0292: Using vibration, e.g. during soldering or screen printing
- H05K 2203/0425: Solder powder or solder coated metal powder
- H05K 2203/043: Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
- H05K 2203/1527: Obliquely held PCB
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM

## Abstract

A method for producing a solder circuit board includes imparting tackiness to a surface of a conductive circuit electrode provided on a printed wiring board to form a tackiness-imparted area. depositing solder powder on the tackiness-imparted area and heating the printed wiring board so as to melt the solder to thereby form a solder circuit. The solder powder is placed in a vessel. The printed wiring board having the electrode whose surface has been imparted with tackiness is placed in the vessel. The vessel is tilted to thereby deposit the solder powder on the tackiness-imparted area.

## Claims

### Claim 1

A method for producing a solder circuit board comprising the steps of:
imparting tackiness to a surface of a conductive circuit electrode provided on a printed wiring board to form a tackiness-imparted area;
depositing solder powder on the tackiness-imparted area; and
heating the printed wiring board so as to melt the solder to thereby form a solder circuit;
wherein the solder powder is dispersed in a liquid in a vessel, the printed wiring board having the electrode whose surface has been imparted with tackiness is placed in the vessel in a horizontal direction, and the vessel is cyclically tilted right and left to thereby deposit the solder powder on the tackiness-imparted area.

### Claim 2 (depends on 1)

A method for producing a solder circuit board according to claim 1, wherein the vessel is tilted right and left so that the solder powder is brought into contact with both surfaces of the printed wiring board to thereby deposit the solder powder on the tackiness-imparted area.

### Claim 3 (depends on 1)

A method for producing a solder circuit board according to claim 1 comprising the step of:
vibrating the vessel to thereby deposit the solder powder on the tackiness-imparted area.

### Claim 4 (depends on 3)

A method for producing a solder circuit board according to claim 3, wherein the vessel is vibrated so that the solder powder is brought into contact with both surfaces of the printed wiring board to thereby deposit the solder powder on the tackiness-imparted area.

### Claim 5 (depends on 1)

A method for producing a solder circuit board according to claim 1, wherein the vessel is a sealable vessel.

### Claim 6 (depends on 1)

A method for producing a solder circuit board according to claim 1, wherein the liquid is a deoxygenated liquid.

### Claim 7 (depends on 1)

A method for producing a solder circuit board according to claim 1, wherein the method employs a solder powder deposition apparatus; the apparatus comprising a vessel for accommodating a solder powder and printed wiring boards, an inlet through which the printed wiring boards are introduced into the vessel, a mechanism for preventing, through tilting of the vessel, contact between the wiring boards and the solder powder during introduction of the wiring boards into the vessel, and a mechanism for tilting or vibrating the vessel in a sealed or non-sealed state; the printing wiring boards are held in an upright posture in the solder powder deposition apparatus, with the wiring boards being arranged in parallel with one another at predetermined intervals, and the vessel is tilted so as to prevent contact between the solder powder and the wiring boards, tilting of the vessel is reversed, to thereby bring the solder powder into contact with the wiring boards, and the vessel is tilted or vibrated.