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US 8,119,225 B2Granted
Copper clad laminate, prepreg and method of reducing signal loss
AssigneeVentec Electronics (Suzhou) company limited
InventorsDai Xin Peng, Zhuo Wang
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Abstract
Provided herein are, among other things, epoxy resin varnishes and methods of making and using the same. In some embodiments, the epoxy resin varnishes comprise at least a filler such as silica. In certain embodiments, the epoxy resin varnishes provided herein are used for making laminates such as copper clad laminates. In further embodiments, the copper clad laminates provided herein are used for making printed circuit boards (PCBs).
Claims15
A metal clad laminate comprising:
- a) an insulating layer;
- and
- b) a metal layer on at least one surface of the insulating layer;
- wherein the insulating layer comprising a cured epoxy resin composition and one or more glass fabrics in the cured epoxy resin composition, and wherein the air permeability of the one or more glass fabrics is more than 20 cc/cm2/sec and less than about 90 cc/cm2/sec.
1 more element
Dependencies are inferred from the claim text.