Back to results
US 8,117,986 B2Granted
Apparatus for an improved deposition shield in a plasma processing system
AssigneeTokyo Electron Limited
InventorsHidehito Saigusa, Taira Takase, Kouji Mitsuhashi, Hiroyuki Nakayama
Life of this patent
Estimating the term…
Abstract
The present invention presents an improved deposition shield for surrounding a process space in a plasma processing system, wherein the design and fabrication of the deposition shield advantageously provides for a clean processing plasma in the process space with substantially minimal erosion of the deposition shield.
Claims22
A deposition shield comprising:
- a cylinder configured to surround a process space in a plasma processing system, said cylinder comprising:
- a first sidewall surface defining an interior of the cylinder,
- a second sidewall surface opposing the first sidewall surface and defining an exterior of the cylinder,
- a first end surface extending radially outward from the first sidewall surface to the second sidewall surface, the first end surface extending circumferentially around a complete circumference of the cylinder, and
- a second end surface opposing the first end surface and extending radially outward from the first sidewall surface to the second sidewall surface, the second end surface extending circumferentially around a complete circumference of the cylinder;
- and
- a protective coating provided on said first sidewall surface, on at least a portion of said first end surface, and on at least a portion of said second end surface, said coating comprising yttrium or dysprosium or a combination thereof.
4 more elements
A deposition shield comprising:
- a cylinder configured to surround a process space in a plasma processing system, said cylinder comprising:
- a first sidewall surface defining an interior of the cylinder,
- a second sidewall surface opposing the first sidewall surface and defining an exterior of the cylinder,
- a first end surface extending radially outward from the first sidewall surface to the second sidewall surface, and
- a second end surface opposing the first end surface and extending radially outward from the first sidewall surface to the second sidewall surface;
- and
- a protective coating provided on said first sidewall surface, on at least a portion of said first end surface, and on at least a portion of said second end surface, said coating comprising yttrium or dysprosium or a combination thereof,
- wherein said second end surface comprises:
- an outer end surface extending radially inward from said second sidewall surface;
- and
- a protrusion adjacent to said first sidewall surface and protruding from said outer end surface, said protective coating being provided only on said protrusion.
8 more elements
A deposition shield comprising:
- a cylinder configured to surround a process space in a plasma processing system, said cylinder comprising:
- a first sidewall surface defining an interior of the cylinder,
- a second sidewall surface opposing the first sidewall surface and defining an exterior of the cylinder,
- a first end surface extending radially outward from the first sidewall surface to the second sidewall surface, and
- a second end surface opposing the first end surface and extending radially outward from the first sidewall surface to the second sidewall surface,
- a protective coating provided on said first sidewall surface, on at least a portion of said first end surface, and on at least a portion of said second end surface, said coating comprising yttrium or dysprosium or a combination thereof,
- wherein said first end surface comprises:
- an inner end surface extending radially outward from said first sidewall surface;
- and
- a protrusion adjacent to said second sidewall surface and protruding from said inner end surface, said protective coating being provided on said inner end surface.
7 more elements
Dependencies are inferred from the claim text.