Layer-to-layer interconnects for photoelectric devices and methods of fabricating the same
AssigneeGeneral Electric Company
InventorsJohn Yupeng Gui, Eladio Clemente Delgado
Life of this patent
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Abstract
Interconnects for electronic devices. More specifically, stacked photoelectric devices, such as parallel tandem photovoltaic devices are provided. Each of the photovoltaic devices comprises photovoltaic cells formed between two substrates. Each of the substrates may include one or more interconnects to route a voltage from one side of the substrate to another. Each substrate includes an edge portion extending beyond the edge portion of an immediately adjacent substrate. All interconnects are exposed to one side of the device for easy and flexible electric connectivity and fabrication. The interconnects, which may include conductive vias or conductive edge wraps, are formed in the edge portion of the substrates.
Claims18
A photovoltaic device comprising:
- a plurality of substrates arranged in a stack;
- one or more photovoltaic cells formed between pairs of substrates among the plurality of substrates;
- and
- wherein each of the plurality of substrates comprises a plurality of interconnects configured to provide voltage on each side of each of the plurality of substrates.
An electronic device comprising:
- a plurality of flexible substrates arranged in a stack and having interconnects, wherein each of the interconnects is configured to derive one of a plurality of voltages on a first side of the plurality of flexible substrates and configured to distribute the one of the plurality of voltages to a respective second side of the plurality of flexible substrates;
- and
- a plurality of electronic cells disposed between pairs of flexible substrates among the plurality of flexible substrates.
A photovoltaic device comprising:
- an upper substrate having a top surface and a bottom surface and having a first plurality of active elements disposed on the bottom surface of the upper substrate;
- a lower substrate having a top surface and a bottom surface and having a second plurality of active elements disposed on the top surface of the lower substrate;
- and
- at least one intermediate substrate disposed between the upper and lower substrate and having a top surface and a bottom surface, wherein a third plurality of active elements are disposed on the top surface of the at least one intermediate substrate and a fourth plurality of active elements are disposed on the bottom surface of the at least one intermediate substrate, and
- wherein the at least one intermediate substrate comprises a plurality of interconnects configured to distribute a voltage from the top surface to the bottom surface of the at least one intermediate substrate.
Dependencies are inferred from the claim text.