Back to results
US 8,100,685 B1Granted
Imprint embossing alignment system
AssigneeWD Media, LLC
InventorsBruce M. Harper, Toshiyuki Max Saito
Life of this patent
Estimating the term…
Abstract
An imprint embossing alignment system. In one embodiment, the system includes a die having a bottom surface, an embossing foil positioned above the bottom surface, and a mandrel, to receive the substrate, having a rod portion that extends through a central portion of the die. The system also includes a ball bushing positioned around the rod portion and a ring portion positioned between the ball bushing and the embossing foil to hold a precise alignment of a centerline of the rod portion and a centerline of the embossing foil.
Claims4
An apparatus for imprinting an embossable film disposed above a substrate,
- comprising:
- a die having a bottom surface;
- an embossing foil disposed above the bottom surface;
- a mandrel having a rod portion that extends through a central portion of the die, the mandrel to receive the substrate;
- a ball bushing disposed around the rod portion;
- a ring portion of the die disposed between the ball bushing and the embossing foil to hold a precise alignment of a centerline of the rod portion and a centerline of the embossing foil, wherein a thermal expansion of the ball bushing secures the ring portion to an inner dimension of the embossing foil to center the substrate with the embossing foil.
3 more elements
Dependencies are inferred from the claim text.