Back to results
US 8,097,952 B2Granted
Electronic package structure having conductive strip and method
AssigneeRichtek Technology Corporation
InventorYu-Lin Yang
Life of this patent
Estimating the term…
Abstract
An electronic package structure and method use a conductive strip to bond die-to-die, die-to-lead, chip carrier-to-lead, or lead-to-lead. A conductive strip may carry greater current than a bonding wire, and thus may replace several bonding wires. The bonding of the conductive strip may be carried out by an SMT process, and thus requires lower cost than wire bonding processes. A conductive strip may be bonded to more than two dice or leads to save more bonding wires. A conductive strip is stronger than a bonding wire, and thus lowers the possibility of being broken.
Claims3
An electronic package structure comprising:
- a first die having a first bonding pad thereon;
- a second die having a second bonding pad thereon;
- a chip carrier having a first portion with the first die disposed thereon and a second portion with the second die disposed thereon, the first and second portions being electrically connected to each other;
- and
- a conductive strip integrally formed to define a substantially planar polyhedral plate contour for augmented current flow capacity, the conductive strip extending linearly between the first and second pads to span a space between the first and second dies without intermediate support, the conductive strip being bonded on opposing end portions thereof to the first bonding pad and the and second bonding pads.
2 more elements
Dependencies are inferred from the claim text.