Metrology and 3D reconstruction of devices in a wafer
AssigneeWestern Digital (Fremont), LLC
InventorsAlexandre Anguelouch, Lei Wang, Chester Xiaowen Chien
Life of this patent
Estimating the term…
Abstract
A method for measuring three-dimensional devices in a wafer comprises the step of obtaining a plurality of cross-sectional images of a corresponding plurality of three-dimensional devices in the wafer. The plurality of three-dimensional devices have essentially identical geometries. Each cross-sectional image is obtained from a plane in the corresponding three-dimensional device at a predetermined distance from a fiducial mark thereof. The predetermined distance is different for each of the plurality of cross-sectional images. The method further comprises the step of determining the geometries of the plurality of three-dimensional devices based on the cross-sectional images thereof.
Claims21
A method for measuring three-dimensional devices in a wafer, comprising the steps of:
- obtaining a plurality of cross-sectional images of a corresponding plurality of three-dimensional devices in the wafer, wherein the plurality of three-dimensional devices have essentially identical geometries, wherein each cross-sectional image is obtained from a plane in the corresponding three-dimensional device at a predetermined distance from a fiducial mark thereof, and wherein the predetermined distance is different for each of the plurality of cross-sectional images;
- and
- determining the geometries of the plurality of three-dimensional devices based on the cross-sectional images thereof.
A method for measuring three-dimensional devices in a wafer, comprising the steps of:
- forming a first trench having a first facet a first predetermined distance from a first fiducial mark of a first three-dimensional device in the wafer;
- measuring a first cross-sectional view of the first three-dimensional device at the first facet;
- forming a second trench having a second facet a second predetermined distance from a second fiducial mark of a second three-dimensional device in the wafer, the second three-dimensional device being essentially identical in shape to the first three-dimensional device;
- measuring a second cross-sectional view of the second three-dimensional device at the second facet;
- and
- determining a geometry of the first and second three-dimensional devices based on the measured first and second cross-sectional views.
A machine readable medium carrying one or more sequences of instructions for measuring three-dimensional devices in a wafer, wherein execution of the one or more sequences of instructions by one or more processors causes the one or more processors to perform the steps of:
- obtaining a plurality of cross-sectional images of a corresponding plurality of three-dimensional devices in the wafer, wherein the plurality of three-dimensional devices have essentially identical geometries, wherein each cross-sectional image is obtained from a plane in the corresponding three-dimensional device at a predetermined distance from a fiducial mark thereof, and wherein the predetermined distance is different for each of the plurality of cross-sectional images;
- and
- determining the geometries of the plurality of three-dimensional devices based on the cross-sectional images thereof.
Dependencies are inferred from the claim text.