Cyclic olefin compositions for temporary wafer bonding
AssigneeBrewer Science Inc.
InventorsWenbin Hong, Dongshun Bai, Tony D. Flaim, Rama Puligadda
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Abstract
New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.
Claims13
A wafer bonding method comprising:
- providing a stack comprising first and second substrates bonded together via a bonding layer, said layer being formed from a composition comprising a first cycloolefin copolymer and a second cycloolefin copolymer dissolved or dispersed in a solvent system, said second cycloolefin copolymer being a low molecular weight cycloolefin copolymer, wherein a tackifier is not present in said composition;
- and
- separating said first and second substrates.
Dependencies are inferred from the claim text.