Carbon ribbon to be covered with a thin layer made of semiconductor material and method for depositing a layer of this type
AssigneeSolarforce
InventorChristian Belouet
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Abstract
The present invention relates to a carbon ribbon for covering in a thin layer of semiconductor material, and to a method of deposited such a layer on a substrate constituted by a carbon ribbon. At least one of the two faces of the carbon ribbon is for covering in a layer of semiconductor material by causing the ribbon to pass substantially vertically upwards through a bath of molten semiconductor material. According to the invention, the two edges of at least one of the two faces of the carbon ribbon project so as to form respective rims.
Claims16
A method of depositing a layer of semiconductor material on at least one of two faces of a carbon ribbon, said carbon ribbon having two edges, wherein the method comprises the steps of:
- said carbon ribbon is pulled progressively upwards, substantially vertically, lengthwise through a horizontal equilibrium surface of a bath of molten semiconductor material;
- said semiconductor material becomes deposited by wetting said face as the carbon ribbon is pulled, wherein a shape of the edges of said carbon ribbon is changed so as to increase a thickness of the layer of semiconductor material that is deposited on the two edges of the carbon ribbon.
A carbon ribbon having two edges, with at least one of its two faces being designed to be covered in a layer of semiconductor material by causing said carbon ribbon to pass substantially vertically upwards through a bath of molten semiconductor material, wherein each of its two edges on its two faces projects to form a rim, providing an increased thickness of the layer of semiconductor material deposited on the two edges of the two faces of said carbon ribbon.
Dependencies are inferred from the claim text.