Method for providing a structure in magnetic recording transducer

#Conventional poles and other structures for magnetic recording heads can be fabricated in a number of ways. For example, FIG. 1 is a flow chart depicting a conventional method 10 for fabricating a chemical mechanical planarization (CMPS) support layer of a magnetic recording transducer using a conventional mill-and-refill process. For simplicity, some steps are omitted. FIGS. 2-5 are diagrams a depicting conventional transducer 50 as viewed from the air-bearing surface (ABS) during fabrication. For clarity, FIGS. 2-5 are not drawn to scale. The conventional transducer 50 may be coupled with a slider to form a write head. In addition, a read transducer (not shown) may be included to form a merged head. For simplicity, only a portion of the conventional transducer 50 is shown.

#A conventional magnetic seed layer is provided on a planarized underlayer, via step 12. In some transducers, the conventional magnetic seed layer may be used as a pole. The conventional seed layer is used in fabricating a magnetic pole, for example the main pole for a perpendicular magnetic recording transducer. The magnetic seed layer is generally blanket deposited across both a device region, in which the structure is to be fabricated, and a field region away from the device region. However, for other structures, the layer deposited may reside only in the device region. A photoresist mask is provided on the conventional seed layer, via step 14. FIG. 2 depicts the conventional transducer 50 after step 14 is completed. Thus, an underlayer 52, a conventional seed layer 54, and photoresist mask 56 are shown. The underlayer 52 is typically planarized prior to deposition of the conventional seed layer 54. Consequently, the upper surface of the conventional underlayer 52 is substantially flat. The photoresist mask 56 resides substantially in the device region 60. However, the conventional seed layer 54 extends to the field regions 58.

#The conventional seed layer is milled with an over-mill condition, via step 16. Because the photoresist mask 56 covers the device portion 60, only the portion of the conventional seed layer 54 in the field regions 58 is removed. The over-mill condition is used to ensure complete removal of the portion of the conventional seed layer 54 in the field regions 58. FIG. 3 depicts the conventional magnetic recording transducer 50 after step 16 has been performed. Because an over-mill condition was used, only the portion of the conventional seed layer 54′ in the device region 60 remains. The remainder of the conventional seed layer 54 has been removed.

#FIG. 1 is a flow chart depicting a conventional method for performing a mill-and-fill process a transducer.

#FIGS. 2-5 are diagrams depicting a conventional transducer during fabrication.

#FIG. 6 is a flow chart depicting an exemplary embodiment of a method for fabricating a transducer.

#FIG. 6 is a flow chart depicting an exemplary embodiment of a method 100 for fabricating a transducer. For simplicity, some steps may be omitted. The transducer being fabricated may be part of a merged head including a read transducer and a write transducer. The transducer may reside on a slider (not shown). The method 100 may be used for providing structures on either or both transducers. The method 100 is also described in the context of providing a single structure in a transducer. However, the method 100 may be used to fabricate multiple structures and/or transducers at substantially the same time.

#One or more protective layers are provided on an underlayer of the transducer, via step 102. The protective layer(s) cover a field region and expose a device region, in which the structure is to reside. In one embodiment, the protective layer(s) include a diamond-like carbon (DLC) layer. The protective layer(s) might have a low removal rate in the removal step 106, described below. However, the protective layer(s) can also be removed from the underlayer using a process for which the underlayer has a significantly lower removal rate. Thus, the protective layer(s) may be removed substantially without damaging the underlayer. In one embodiment, the protective layer(s) may be provided using a lift-off process, which leaves the underlayer exposed in the device region. In an alternate embodiment, the protective layer(s) may be blanket deposited on the underlayer, then removed from the device region. In one embodiment, the underlayer on which the protective layer(s) are deposited has undergone a CMP or other planarization step. Thus, the upper surface of the underlayer may be substantially flat.

#At least one layer is provided for the structure being fabricated, via step 104. In one embodiment, the layer(s) reside in the device region and the field region. In another embodiment, the layer(s) are present primarily in the device region. For example, the layer(s) provided in step 104 may include a seed layer and/or other layers for a pole. In such an embodiment, the seed layer may be magnetic and may be deposited on both the field and device regions. In such an embodiment, a portion of the seed layer may be used as a pole. In another embodiment, the layer(s) may be provided primarily in the device region, with only a small portion residing in part of the field regions. For example, in one such embodiment, the layer(s) may form the reader. This may be accomplished, for example, through the use of a photoresist mask during deposition or removal in at least part of the field regions. In one embodiment, step 104 may be performed before step 102.