Resin composition and semiconductor device produced by using the same

A resin composition used as an adhesive for bonding a semiconductor chip or a heat dissipating member, comprising at least a silver powder (A) having an average particle size of 1 to 30 μm, the following compound (B), a thermal radical initiator (C) and the following allyl ester compound (G), and substantially not containing a photo polymerization initiator:

• Compound (B):
• a bis-maleimide compound (B′) represented by the following formula (3):
• wherein X2 is —O—;
• each R4 is a hydrogen atom or a methyl group;
• each R5 is a hydrocarbon group having 1 to 11 carbons and containing no aromatic group;
• each R6 is a hydrocarbon group having 3 to 6 carbons and containing no aromatic group;
• “n” is an integer from 1 to 50;
• and if the formula contains two or more parts which are denoted by the same symbol, each of them may be the same or different from each other;
• Allyl ester compound (G):
• a compound having at least one functional group represented by the following formula (8):
• Formula (8):
• CH2═CH—CH2—OCO—R12— (8)
• wherein R12 is a hydrocarbon group having 2 to 8 carbons.