Connector with improved shielding in mating contact region
AssigneeAmphenol Corporation
InventorsDavid Paul Manter, Thomas S. Cohen
Life of this patent
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Abstract
An electrical connector system includes a daughter card connector formed of a plurality of wafers. Each wafer is formed with cavities between the contacts of the signal conductors. The cavities are shaped to receive lossy inserts whereby crosstalk is reduced. The connector system may also or alternatively include a front housing formed with shield plates also to aid in reducing cross-talk. The front housing is adapted to mate between the wafers of the daughter card connector and a backplane connector of the electrical connector system. In an alternative embodiment, the front housing portion may include lossy conductive portions for cross-talk reduction.
Claims18
A method of manufacturing an electrical connector having a wafer, the method comprising:
- molding an insulative housing over at least a portion of a frame of the wafer, the insulative housing adapted to be positioned next to at least a portion of a plurality of signal conductors;
- providing a plurality of cavities in the insulative housing;
- and
- inserting each of a plurality electrically lossy material elements into a respective one of the plurality of cavities;
- wherein the plurality of individual electrically lossy material elements are positioned proximate to mating ends of the plurality of signal conductors;
- wherein each of the plurality of individual electrically lossy material elements is positioned between at least two of the plurality of signal conductors.
An electrical connector, comprising:
- at least one wafer having a plurality of signal conductors;
- at least one insulative material adopted to be positioned next to at least a portion of the plurality of signal conductors, the at least one insulative material having a plurality of cavities;
- and
- a plurality of individual electrically lossy material elements separate from each other, each adapted to be inserted into a respective one of the plurality of cavities;
- wherein the plurality of individual electrically lossy material elements are positioned proximate to mating ends of the plurality of signal conductors;
- wherein each of the plurality of individual electrically lossy material elements is positioned between at least two of the plurality of signal conductors.
A method of manufacturing at least a portion of an electrical connector system having a wafer, the method comprising:
- molding a housing for the wafer with at least one insulative material having a plurality of cavities;
- providing at least a plurality of signal conductors, one of said plurality of signal conductors positioned adjacent a respective one of said cavities;
- and
- inserting at least one of a plurality of individual electrically lossy material elements separate from each other into a respective one of the plurality of cavities;
- wherein the plurality of individual electrically lossy material elements are positioned proximate to mating ends of the plurality of signal conductors;
- wherein each of the plurality of individual electrically lossy material elements is positioned between at least two of the plurality of signal conductors.
An electrical connector, comprising:
- at least one wafer formed of insulative material having a plurality of cavities;
- a plurality of signal conductors, at least one of said plurality of signal conductors positioned adjacent a respective one of said cavities;
- a plurality of individual electrically lossy material elements separate from each, each adapted to be inserted into a respective one of the plurality of cavities;
- wherein the plurality of individual electrically lossy material elements are positioned proximate to mating ends of the plurality of signal conductors;
- wherein each of the plurality of individual electrically lossy material elements is positioned between at least two of the plurality of signal conductors.
Dependencies are inferred from the claim text.