Sensor module with mold encapsulation for applying a bias magnetic field

A sensor module, comprising:

• a substrate comprising a magnetically sensitive element;
• a non-magnetic structure positioned over the magnetically sensitive element, wherein the non-magnetic structure has one of a substantially conical shape and a substantially convex shape;
• and
• at least one mold structure encapsulating the magnetically sensitive element and the substrate, the at least one mold structure configured to apply a bias magnetic field to the magnetically sensitive element.

A sensor module, comprising:

• a semiconductor substrate comprising a magnetically sensitive element;
• a polymer structure positioned over the magnetically sensitive element, wherein the polymer structure has one of a substantially conical shape and a substantially convex shape;
• and
• a mold with magnetic particles encapsulating the polymer structure, the magnetically sensitive element, and the substrate, the mold configured to apply a bias magnetic field to the magnetically sensitive element.

A method of manufacturing a sensor module, comprising:

• providing a substrate comprising a plurality of magnetically sensitive sensor elements;
• encapsulating the sensor elements and the substrate with at least one mold material that is configured to apply a bias magnetic field to the sensor elements;
• and
• applying a non-magnetic structure over each of the sensor elements prior to the encapsulation, wherein the at least one mold material encapsulates the plurality of sensor elements, the non-magnetic structures, and the substrate, wherein the non-magnetic structure has one of a substantially conical shape and a substantially convex shape.