Printed circuit boards having pads for solder balls and methods for the implementation thereof
AssigneeIntel Corporation
InventorsCheng Siew Tay, Wendy Chet Ming Ngoh, Choi Keng Chan
Life of this patent
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Abstract
A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a location where cracks in a solder-ball are anticipated to start after that solder-ball is soldered to that pad. For a pad of that group having a microvia located therein, a center of that microvia is located farther than a center of that pad from its crack initiation point. For a pad of that group having a trace merging along a portion of its perimeter, that portion does not include a vicinity of that crack initiation point.
Claims18
An apparatus comprising:
- an audio input device;
- and
- a printed circuit board having a device installed thereon, the printed circuit board including at least:
- pads soldered to respective solder-balls of the device, wherein at least one of the pads has a microvia located therein, and wherein the pad has a crack initiation point located on a perimeter of the pad at a location where cracks in a solder-ball are anticipated to start after the solder-ball is soldered to the pad, and wherein the center of the microvia is farther than the center of the pad from the crack initiation point.
An apparatus comprising:
- an audio input device;
- and
- a printed circuit board having a device installed thereon, the printed circuit board including at least:
- pads soldered to respective solder-balls of the device, wherein one of the pads has a trace merged thereto, and wherein a perimeter of one of the pads has a crack initiation point located on a perimeter of the pad at a location where cracks in a solder-ball are anticipated to start after the solder-ball is soldered to the pad, and wherein the pad merges with the trace along a portion of the perimeter that does not include a vicinity of the crack initiation point, and wherein the portion is not longer than the length of one quarter of the perimeter.
A method for merging a trace with a pad of a printed circuit board suitable to be soldered to a respective solder-ball of a device, comprising:
- identifying a crack initiation point on a perimeter of the pad at a location where cracks in the solder-ball are anticipated to start after the solder-ball is soldered to the pad;
- and
- merging the trace with the pad at a portion of the perimeter that does not include the crack initiation point, wherein the portion is not longer than the length of one quarter of the perimeter.
A method, comprising:
- for a pad of a printed circuit board that is suitable to be soldered to a respective solder-ball of a device,
- identifying a crack initiation point on a perimeter of the pad at a location where cracks in the solder-ball are anticipated to start after the solder-ball is soldered to the pad;
- and
- locating a center of a microvia within the pad farther than the center of the pad from the crack initiation point.
A non-transitory storage medium having stored thereon instructions for merging a trace with a pad of a printed circuit board that is suitable to be soldered to a respective solder-ball of a device, wherein the instructions when executed by a computing platform result in:
- identifying a crack initiation point on a perimeter of the pad at a location where cracks in the solder-ball are anticipated to start after the solder-ball is soldered to the pad;
- and
- merging the trace with the pad at a portion of the perimeter that does not include the crack initiation point, wherein the portion is not longer than a length of one quarter of the perimeter.
A non-transitory storage medium having stored thereon instructions for locating a microvia within a pad of a printed circuit board that is suitable to be soldered to a respective solder-ball of a device, wherein the instructions when executed by a computing platform result in:
- identifying a crack initiation point on a perimeter of the pad at a location where cracks in the solder-ball are anticipated to start after the solder-ball is soldered to the pad;
- and
- locating a center of the microvia within the pad farther than the center of the pad from the crack initiation point.
Dependencies are inferred from the claim text.