Method and device for three-dimensional path planning to avoid obstacles using multiple planes

An integrated module for three-dimensional path planning, the integrated module comprising:

• an inertial measurement unit;
• at least one obstacle-detection sensor;
• and
• an obstacle-avoidance-processor chip comprising:
• an analog processing circuit communicatively coupled to receive data indicative of a relative position of a vehicle in an environment from the inertial measurement unit and to receive sensor data indicative of obstacles in the environment from the at least one obstacle-detection sensor, the analog processing circuit configured to construct a three-dimensional obstacle map based on the received data;
• and
• at least two analog-resistive-grid networks configured to map obstacles in at least two respective non-parallel planes, wherein the at least two analog-resistive-grid networks represent at least two respective cross-sections of a constructed three-dimensional obstacle map, wherein the at least two respective cross-sections of the constructed three-dimensional obstacle map form a quasi-three-dimensional representation of the environment,
• wherein the obstacle-avoidance-processor chip generates information indicative of at least one unobstructed path in the environment based on the obstacle maps.

A method of planning an unobstructed three-dimensional path for a vehicle, the method comprising:

• receiving information indicative of the environment in which the vehicle is moving;
• constructing a three-dimensional obstacle map of the environment based on the information indicative of the environment;
• executing software to solve Laplacian equations for a high-density analog-resistive-grid network;
• executing software to solve Laplacian equations for at least one lower-density analog-resistive-grid network;
• and
• producing an unobstructed three-dimensional path for the vehicle to follow based on the executions of the software to solve Laplacian equations.