Communication methods, methods of forming an interconnect, signal interconnects, integrated circuit structures, circuits, and data apparatuses
AssigneeMicron Technology, Inc.
InventorChandra Mouli
Life of this patent
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Abstract
Some embodiments include communication methods, methods of forming an interconnect, signal interconnects, integrated circuit structures, circuits, and data apparatuses. In one embodiment, a communication method includes accessing an optical signal comprising photons to communicate information, accessing an electrical signal comprising electrical data carriers to communicate information, and using a single interconnect, communicating the optical and electrical signals between a first spatial location and a second spatial location spaced from the first spatial location.
Claims44
A communications method comprising:
- using an interconnect, concurrently communicating a first signal comprising encoded data content and a second signal comprising information regarding encoding of the encoded data content of the first signal.
A method of forming an interconnect comprising:
- providing a transmission medium which is configured to communicate a plurality of photons and a plurality of electrical data carriers;
- electrically insulating the transmission medium from a substrate;
- and
- optically insulating the transmission medium from the substrate.
A circuit comprising:
- a plurality of optical interfaces which are spaced from one another;
- a plurality of electrical interfaces which are spaced from one another;
- and
- an interconnect configured to concurrently transmit a plurality of photons of an optical information signal between the plurality of optical interfaces and a plurality of electrical data carriers of an electrical information signal between the plurality of electrical interfaces.
An integrated circuit structure comprising:
- a substrate;
- and
- a transmission medium configured to concurrently transmit a plurality of photons of an optical signal between a plurality of different spatial locations of the substrate and a plurality of electrical data carriers of an electrical signal between a plurality of different spatial locations of the substrate.
A circuit comprising:
- an optical source configured to provide optical signals comprising photons;
- an electrical source configured to provide electrical signals comprising electrical data carriers;
- and
- an interconnect optically coupled with the optical source and configured to receive the photons of the optical signals from the optical source and to transmit the photons of the optical signals remotely from the optical source, and wherein the interconnect is electrically coupled with the electrical source and configured to receive the electrical data carriers of the electrical signals from the electrical source and to transmit the electrical data carriers remotely from the electrical source.
A circuit comprising:
- a first information source configured to provide first signals comprising data content;
- a second information source configured to provide second signals comprising information regarding the first signals;
- and
- an interconnect coupled with the first and second information sources and configured to receive the first and second signals from the first and second information sources and to transmit the first and second signals remotely from the first and second information sources.
A data apparatus comprising:
- an information source configured to provide a first information signal to be communicated;
- an interconnect coupled with the information source and configured to receive the first information signal from the information source and to concurrently transmit the first information signal with a second information signal which comprises information which is different than information of the first information signal;
- and
- wherein the interconnect is configured to concurrently transmit a plurality of photons of one of the first and second information signals which comprises an optical signal with a plurality of electrical data carriers of another of the first and second information signals which comprises an electrical signal.
Dependencies are inferred from the claim text.