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US 8,077,478 B2Granted
Module board
AssigneePanasonic Corporation
InventorsMasahiro Takatori, Yukihiro Ishimaru
Life of this patent
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Abstract
A module board has a configuration in which a first circuit board, a first composite sheet, a second circuit board, a second composite sheet, and a third circuit board are laminated in this order. Inspection terminals are arranged in a matrix shape in a predetermined region on an upper surface of the third circuit board. Electronic components are mounted on the first and second circuit boards. The inspection terminals are electrically connected to the electronic components mounted on the first and second circuit boards through vias and wiring patterns.
Claims3
A module board comprising:
- a plurality of circuit boards laminated in the vertical direction and each having a wiring pattern;
- one or a plurality of electronic components mounted on at least one of said plurality of circuit boards and electrically connected to said wiring pattern;
- a plurality of first terminals provided on a lower surface of the lowermost one of said plurality of circuit boards and electrically connected to said wring pattern;
- a plurality of second terminals provided on a peripheral region along at least one side of an upper surface of the uppermost one of said plurality of circuit boards and electrically connected to said wiring pattern;
- and
- a protector formed on a region, excluding said peripheral region on the upper surface of said uppermost circuit board, so as to cover said one or plurality of electronic components, no protector being formed in said peripheral region and wherein
- a pitch between said plurality of second terminals is smaller than a pitch between said plurality of first terminals.
4 more elements
Dependencies are inferred from the claim text.