Electronic device mounting structure
AssigneeDenso Corporation
InventorsAkio Yasuda, Kenichi Mori
Life of this patent
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Abstract
An electronic device mounting structure includes a thermally conductive base, a busbar located on the base, an electronic device mounted on the busbar, a thermally conductive wall standing on the base and having first and second portions located opposite each other across the electronic device, and a plate spring supported by the first and second portions of the wall. The plate spring presses the electronic device against the base so that thermal resistance between the electronic device and the base is reduced. The plate spring has a thermal conductivity so that heat in the electronic device is transferred to the wall through the plate spring.
Claims12
An electronic device mounting structure comprising:
- a base having a thermal conductivity;
- a busbar located on a surface of the base and electrically insulated from the base;
- an electronic device located on the busbar and electrically coupled to a first end of the busbar;
- a wall member having a thermal conductivity and standing on a surface of the base, the wall member including first and second portions located opposite each other across the electronic device;
- and
- a plate spring supported by the first and second portions of the wall member and extending substantially parallel to the surface of the base, the plate spring pressing the electronic device against the base though the busbar and having a thermal conductivity to transfer heat from the electronic device to the wall member therethrough.
Dependencies are inferred from the claim text.