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US 8,077,475 B2Granted
Electronic device
AssigneeInfineon Technologies AG
InventorRalf Otremba
Life of this patent
Estimating the term…
Abstract
An electronic device is disclosed. One embodiment provides a metallic body. A first electrically insulating layer is applied over the metallic body and having a thickness of less than 100 μm. A first thermally conductive layer is applied over the first electrically insulating layer and having a thermal conductivity of more than 50 W/(m·K). A second electrically insulating layer is applied over the first thermally conductive layer and having a thickness of less than 100 μm.
Claims21
An electronic device, comprising:
- a metallic body comprising a die pad and a plurality of lead, with one of the leads electrically coupled to the die pad;
- a semiconductor chip including an electrode electrically coupled to the die pad;
- a first electrically insulating layer applied over at least a portion of the die pad outside of a region covered by the semiconductor chip and having a thickness of less than 100 μm;
- a first thermally conductive layer applied over the first electrically insulating layer and having a thermal conductivity of more than 50 W/(m·K);
- a second electrically insulating layer applied over the first thermally conductive layer and having a thickness of less than 100 μm;
- and
- a mold material partially encapsulating the die pad and the leads, wherein a portion of the die pad which is exposed from the mold material is completely covered by the first electrically insulating material.
4 more elements
An electronic device, comprising:
- a metallic body comprising a die pad and a plurality of leads with one of the leads electrically coupled to the die pad;
- a semiconductor chip including an electrode electrically coupled to the die pad;
- a first electrically insulating layer applied over at least a portion of the die pad outside of a region covered by the semiconductor chip, the first electrically insulating layer having a thickness of less than 100 μm and being made of a first material;
- a second electrically insulating layer applied over the first electrically insulating layer, the second electrically insulating layer having a thickness of less than 100 μm and being made of a second material;
- and
- a mold material partially encapsulating the die pad and the leads, wherein a portion of the die pad which is exposed from the mold material is completely covered by the first electrically insulating layer.
3 more elements
An electronic device, comprising:
- a leadframe comprising a die pad and a plurality of leads separate from the die pad, the die pad having a first surface and an opposing second surface;
- a semiconductor chip applied over the first surface of the die pad and electrically coupled to the die pad;
- a first electrically insulating layer applied over the second surface of the die pad and having a thickness of less than 100 μm;
- a first electrically conductive layer applied over the first electrically insulating layer;
- and
- a second electrically insulating layer applied over the first electrically conductive layer and having a thickness of less than 100 μm;
3 more elements
Dependencies are inferred from the claim text.