Printed circuit board with tin pads
AssigneeHon Hai Precision Industry Co., Ltd.
InventorShu-Tzu Liu
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AssigneeHon Hai Precision Industry Co., Ltd.
InventorShu-Tzu Liu
Estimating the term…
A printed circuit board of the present disclosure includes a main body, a tin layer, and a solder mask. The main body defines a through hole configured for being connected to a grounding component. The tin layer is formed on a surface of the main body around the through hole. The tin layer contacts the grounding component. The solder mask is formed between a periphery of the through hole and the tin layer. The solder mask is configured to prevent tin cream of the tin layer from flowing into the through hole.
A printed circuit board, comprising:
A printed circuit board, comprising:
A printed circuit board, comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
Apparatus or processes for manufacturing printed circuits: filling or covering plated through-holes or blind plated vias, e.g. for masking or for…
Electrical arrangements not otherwise provided for: grounding of printed circuits by connection to external grounding means
Use of materials for the substrate: insulated conductive substrates, e.g. insulated metal substrate
Via connections; Lands around holes or via connections: lands, clearance holes or other lay-out details concerning the surrounding of a via
About 3 years 9 months of term left · ends 14 Jul 2030 (estimated)
1. Technical Field
The present disclosure relates to printed circuit boards, more particularly to a printed circuit board that can reduce electromagnetic interference.
2. Discussion of the Related Art
The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present printed circuit board. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
FIG. 1 is a partial top view of a printed circuit board in accordance with one embodiment of the present disclosure.
FIG. 2 is a partial bottom view of the printed circuit board in FIG. 1.
Referring to FIGS. 1 and 2, one embodiment of a printed circuit board 10 of the present disclosure includes a main body 12. The main body 12 defines a through hole 14 and a plurality of conductive vias 16. The conductive vias 16 are defined around a periphery of the through hole 14, and are arranged in a ring and substantially evenly spaced apart in one embodiment. The through hole 14 is configured for connecting to a grounding component, so that the printed circuit board 10 is grounded. In this embodiment, the through hole 14 is circular. The through hole 14 may be quadrate or other shapes in other embodiments.
The main body 12 includes a first surface 122 and a second surface 124 opposite to the first surface 122. A plurality of first tin pads 18 and a first copper layer 20 are formed on the first surface 122. The first tin pads 18 are substantially evenly arranged around the periphery of the through hole 14. The first tin pads 18 and the conductive vias 16 are positioned in an alternating manner on/in the periphery of the through hole 14.
A tin layer 22 and a solder mask 24 are formed on the second surface 124 of the main body around the through hole 14. A first portion 24a of the solder mask 24 is formed between a periphery of the through hole 14 and the tin layer 22. The tin layer 22 includes four semicircular-shaped portions substantially evenly arranged around the through hole 14. A second portion 24b of the solder mask 24 is formed between adjacent fan-shaped portions. In one embodiment, a color of the solder mask 24 may be green which is beneficial to one's eyes. Depending on the embodiment, the color of the solder mask 24 may be yellow, white, black, or other colors.