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US 8,077,463 B2Granted
Heat dissipating system
AssigneeHon Hai Precision Industry Co., Ltd.
InventorMario John Dominic Lee
Life of this patent
Estimating the term…
Abstract
A heat dissipating system includes an electronic device, a refrigeration device, a thermal connector, a cold plate, and a pipe. The cold plate is located in the electronic device for absorbing the heat. The refrigeration device is capable of refrigerating a coolant. The thermal connector is in contact with the cold plate. The pipe connects the thermal connector to the refrigeration device so that the coolant is capable of flowing out of the refrigeration device to the thermal connector and back to the refrigeration device.
Claims15
A heat dissipating system comprising:
- a cold plate located within a chassis of an electronic device;
- a refrigeration device capable of refrigerating a coolant therein;
- a thermal connector embedded in the cold plate;
- and
- a heat pipe containing the coolant, the heat pipe connecting with the thermal connector and the refrigeration device so that the coolant is capable of flowing out of the refrigeration device to the thermal connector and back to the refrigeration device.
2 more elements
A heat dissipating system comprising:
- a cold plate located in a chassis of an electronic device;
- a thermal connector embedded in the cold plate;
- a refrigeration device capable of refrigerating a coolant;
- and
- a heat pipe inserted into the chassis to connect the cold plate with the refrigeration device so that the coolant is capable of circulating between the refrigeration device and the cold plate through the thermal connector.
2 more elements
Dependencies are inferred from the claim text.