Airflow guiding cover and electronic device having the same
AssigneeHon Hai Precision Industry Co., Ltd.
InventorZhi-Bin Guan
Life of this patent
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AssigneeHon Hai Precision Industry Co., Ltd.
InventorZhi-Bin Guan
Estimating the term…
An electronic device includes a base, a motherboard having an electronic component, a fan unit, and an airflow guiding cover. The airflow cover includes a top panel and two side panels. An air channel is bounded by the top panel and the side panels. The electronic component is received in the air channel. The air channel includes opposite open ends. The fan unit aligns with one of the open ends of the air channel, to draw airflow in the air channel out. The top panel defines a plurality of through holes adjacent to the fan unit, to discharge a part of the airflow in the air channel out of the airflow guiding cover, for reducing change of the pressure gradient of the airflow, thereby reducing aerodynamic noise.
An electronic device, comprising:
Dependencies are inferred from the claim text.
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Forced ventilation of a gaseous coolant: within server blades for removing heat from heat source
Constructional details or arrangements: cooling means
Forced ventilation, e.g. by fans: means for directing air flow, e.g. ducts, deflectors, plenum or guides
Indexing scheme relating to G06F1/20: cooling arrangements using cooling fluid
About 3 years 1 month of term left · ends 25 Nov 2029 (estimated)
1. Technical Field
The present disclosure relates to an electronic device with an airflow guiding cover.
2. Description of Related Art
FIG. 1 is an exploded, isometric view of a first embodiment of an electronic device with an airflow guiding cover.
FIG. 2 is an assembled, isometric view of the electronic device of FIG. 1.
FIG. 3 is an assembled, isometric view of a second embodiment of an electronic device with an airflow guiding cover.
Referring to FIGS. 1 and 2, an electronic device 10 according to a first embodiment of the present disclosure includes a base 12, a motherboard 13, a plurality of fans 151, and an airflow guiding cover 20.
The base 12 includes a bottom wall 121, and two opposite sidewalls 123 extending from opposite ends of the bottom wall 121. A first opening 124 is defined on a side of the base 12 between the sidewalls 123, and a second opening 125 is defined on an side of the base 12 opposite to the first opening 124 between the sidewalls 123. The motherboard 13 is installed on the bottom wall 121. A plurality of electronic components 134 is mounted to the motherboard 13. The plurality of fans 151 cooperates to make up a fan unit 15, and is mounted to the bottom wall 121 adjacent to the second opening 125, for drawing heat produced by the plurality of electronic components 134 out of the electronic device 10. The airflow guiding cover 20 includes a top panel 21 and two opposite side panels 22 perpendicularly extending down from the top panel 21. An air channel 23 having opposite open ends 231 is bounded by the top panel 21 and the side panels 22. A plurality of spaced acoustic damping areas 24 is defined in the top panel 21, adjacent to one of the open ends 231. Each acoustic damping area 24 includes a plurality of rectangular-arrayed through holes 241.
The airflow guiding cover 20 is mounted to the motherboard 13, the plurality of electronic components 134 is received in the air channel 23 of the airflow guiding cover 20, the plurality of fans 151 of the fan unit 15 aligns with one of the open ends 231 adjacent to the plurality of acoustic damping areas 24 of the airflow guiding cover 20, and the other one of the open ends 231 of the air channel 23 aligns with the first opening 124 of the base 12. The plurality of acoustic damping areas 24 correspondingly aligns with tops of the plurality of fans 151.