Electronic element package and method of manufacturing the same

An electronic element package comprising

• a plate-like sensor substrate having a detector formed thereon, and a plate-like first cover substrate and a plate-like second cover substrate joined directly or indirectly to a top surface and a bottom surface, respectively, of the sensor substrate so that the sensor substrate is located between the first and second cover substrates,
• the sensor substrate comprising:
• at least a first detecting portion and a second detecting portion as the detector;
• a frame surrounding but spaced from the detector;
• at least two beams joining the detector to the frame;
• and an electrode on the frame and electrically connected to the detector,
• one of the first cover substrate and the second cover substrate including a through-hole having an inner wall whose end surface contacts at least a part of the electrode,
• wherein the first detecting portion and the second detecting portion are coplanar;
• and
• wherein portions of a surface of the cover substrates located opposite the sensor substrate are recessed, and positioned in association with the detecting portions.