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AssigneeMurata Manufacturing Co., Ltd.
InventorsToshiyuki Iwanaga, Akihiro Motoki, Makoto Ogawa, Kenichi Kawasaki, Shunsuke Takeuchi, Seiichi Nishihara, Shuji Matsumoto
Estimating the term…
A method for manufacturing a monolithic ceramic electronic component includes a plating substep of depositing precipitates primarily composed of a specific metal on an end of each of internal electrodes exposed at a predetermined surface of a laminate and growing the precipitates to coalesce into a continuous plated layer, wherein the specific metal is different from that of the internal electrodes, and the same or substantially the same metal that defines the internal electrodes is distributed throughout the plated layer.
A monolithic ceramic electronic component comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
Fixed capacitors; Processes of their manufacture: stacked capacitors
Layered products essentially comprising ceramics
Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors: the terminals or tapping…
Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered…:…
About 2 years 7 months of term left · ends 28 May 2029 (estimated)
1. Field of the Invention
The present invention relates to a monolithic ceramic electronic component and a method for manufacturing the monolithic ceramic electronic component and, in particular, to a monolithic ceramic electronic component in which external electrodes are directly formed on the surface of a laminate by plating and a method for manufacturing the monolithic ceramic electronic component.
2. Description of the Related Art
FIG. 1 is a cross-sectional view of a monolithic ceramic electronic component 1 according to a first preferred embodiment of the present invention.
FIG. 2 is an enlarged fragmentary cross-sectional view of a laminate illustrated in FIG. 1.
FIG. 3 is a cross-sectional view illustrating the formation of a Kirkendall void.
A monolithic ceramic electronic component 1 according to a first preferred embodiment of the present invention and a method for manufacturing the monolithic ceramic electronic component 1 are described below with reference to FIGS. 1 and 2.
As illustrated in the cross-sectional view of FIG. 1, the monolithic ceramic electronic component 1 includes a laminate 2, which includes laminated ceramic layers 3 and internal electrodes 4 and 5 alternately disposed between the ceramic layers 3. When the monolithic ceramic electronic component 1 is a monolithic ceramic capacitor, the ceramic layers 3 are composed of dielectric ceramic. An end of each of the internal electrodes 4 is exposed at an end surface 6 of the laminate 2. An end of each of the internal electrodes 5 is exposed at an end surface 7. External electrodes are formed on the end surfaces 6 and 7 to electrically connect the corresponding ends of the internal electrodes 4 and 5.
The external electrodes include first plated layers 8 and 9 formed of precipitates by wet plating, such as electroplating or electroless plating, for example. The first plated layers 8 and 9 are electrically connected directly to the internal electrodes 4 and 5. In other words, the first plated layers 8 and 9 do not include an electroconductive paste film, a vacuum-deposited film, or a sputtered film, for example.