Method and system for mitigating risk of electrostatic discharge for a system on chip (SOC)
AssigneeBroadcom Corporation
InventorsHooman Darabi, Ming Wang Sze, Kent Oertle, Paul Chang
Life of this patent
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AssigneeBroadcom Corporation
InventorsHooman Darabi, Ming Wang Sze, Kent Oertle, Paul Chang
Estimating the term…
Aspects of a method and system for mitigating risk of electrostatic discharge in a system on chip are provided. In this regard, for an IC comprising a plurality of portions electrically isolated from one another within the IC, ESD current may be routed via one or more paths within and/or on a package to which the IC is bonded. The one or more paths may electrically couple two or more of the portions of the IC. The one or more paths may have low impedance at DC and high impedance at one or more frequencies utilized in the integrated circuit. One of the portions of the IC may be a ground plane for RF circuitry. One of the portions of the IC may be a ground plane for digital circuitry. The one or more paths may be fabricated in one or more metal layers of said package.
A method for controlling electrostatic discharge, the method comprising:
A system for controlling electrostatic discharge, the system comprising:
Dependencies are inferred from the claim text.