Electromagnetic bandgap structure and printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJa-Bu Koo, Mi-Ja Han, Han Kim
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AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJa-Bu Koo, Mi-Ja Han, Han Kim
Estimating the term…
Disclosed are an electromagnetic bandgap structure and a printed circuit board. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a dielectric layer; a plurality of conductive plates; a stitching via, configured to pass through the dielectric layer and have a part electrically connecting the conductive plates to each other by connecting through a planar surface that is different from a planar surface of the conductive plates, and a through via. Here, the dielectric layer, the conductive plates and the stitching via can be placed between any two conductive layers, and the through via can be configured to pass through a clearance hole formed in the conductive layer and electrically connect the two conductive layers to each other.
An electromagnetic bandgap structure, comprising:
A printed circuit board comprising:
Dependencies are inferred from the claim text.