A method of forming a packaged power device, comprising:
- mounting a transistor on a base, the transistor including a control terminal and an output terminal and being configured to operate at a fundamental operating frequency;
- forming a harmonic signal reducer on the base and connecting the harmonic signal reducer to the control terminal of the transistor, wherein the harmonic signal reducer is configured to provide a short circuit or low impedance path from the control terminal to ground for signals at an Nth harmonic frequency of the fundamental operating frequency, where N>1;
- providing a signal input lead and a signal output lead on opposite sides of the base;
- connecting the signal input lead to the control terminal and connecting the signal output lead to the output terminal;
- and
- forming a package housing on the transistor and the harmonic reducer, with the signal input lead and the signal output lead extending from the package;
- wherein forming the harmonic signal reducer comprises providing a capacitor on the base and forming a wire bond connection between the capacitor and the transistor.