Semiconductor device

A semiconductor device comprising a balance amplifier type power amplifier comprising a balance amplifier type first power amplifier comprised of an amplifier for a first negative path and an amplifier for a first positive path, and a second power amplifier comprised of an amplifier for a second negative path and an amplifier for a second positive path, said semiconductor device comprising:

• (a) a wiring board;
• (b) a semiconductor chip mounted over the wiring board and comprising a plurality of transistors that configure the first power amplifier and the second power amplifier respectively:
• (c1) a first matching circuit electrically coupled to the amplifier for the first negative path;
• (c2) a second matching circuit electrically coupled to the amplifier for the first positive path;
• (c3) a third matching circuit electrically coupled to the amplifier for the second negative path;
• and
• (c4) a fourth matching circuit electrically coupled to the amplifier for the second positive path,
• wherein the semiconductor chip has two pairs of edges which includes a first edge,
• wherein the semiconductor chip comprises first and second regions divided by a first straight line that passes through a center of the semiconductor chip,
• wherein the first matching circuit, the third matching circuit, the negative path of the first power amplifier and the negative path of the second power amplifier are disposed in the first region lying over the semiconductor chip,
• wherein the second matching circuit, the fourth matching circuit, the positive path of the first power amplifier and the positive path of the second power amplifier are disposed in the second region lying over the semiconductor chip,
• wherein the first matching circuit and the second matching circuit are disposed symmetrically with respect to the first straight line,
• wherein the third matching circuit and the fourth matching circuit are disposed symmetrically with respect to the first straight line,
• wherein a shortest distance between the first positive path and the first edge is smaller than a shortest distance between the first negative path of the first power amplifier and the first edge,
• wherein the first matching circuit couples to a first pad via a first wiring line,
• wherein the second matching circuit couples to a second pad via a second wiring line, and
• wherein a shortest distance between the second pad and the first edge is smaller than a shortest distance between the first pad and the first edge.