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US 8,076,833 B2Granted
Methods and apparatuses for enhancing heat dissipation from a light emitting device
AssigneeBridgelux, Inc.
InventorChris Lowery
Life of this patent
Estimating the term…
Abstract
A light emitting device and method of producing the same is disclosed. The light emitting device includes a phosphor layer and a wire mesh thermally coupled to the phosphor layer and configured to dissipate heat from the phosphor layer.
Claims19
A light emitting device, comprising:
- a substrate having a cavity;
- a wire mesh coupled to a mesh support member, wherein the wire mesh is arranged above and apart from the cavity and the substrate;
- a phosphor layer thermally coupled to the wire mesh, wherein the wire mesh is configured to dissipate heat from the phosphor layer, and wherein the mesh support member comprises a thermally conductive material apart from the cavity and the substrate, the mesh support member being thermally coupled to the wire mesh;
- and
- a heat sink coupled to the mesh support member, wherein the wire mesh thermally couples the phosphor layer to the heat sink via the mesh support member.
2 more elements
A light emitting device, comprising:
- a substrate having a cavity;
- a wire mesh having a first thermal conductivity, wherein the wire mesh is arranged above and apart from the cavity and the substrate;
- a phosphor layer having a second thermal conductivity formed above and apart from the cavity and the substrate, wherein the phosphor is thermally coupled to the wire mesh, and wherein the first thermal conductivity is greater that the second thermal conductivity;
- a mesh support member thermally coupled to the wire mesh, wherein the mesh support member comprises a thermally conductive material apart from the substrate;
- and
- a heat sink coupled to the mesh support member, wherein the wire mesh thermally couples the phosphor layer to the heat sink via the mesh support member.
3 more elements
A method for manufacturing a light emitting device, comprising:
- forming a cavity in a substrate;
- forming a wire mesh;
- attaching the wire mesh above the cavity and the substrate to a mesh support member, wherein the mesh support member comprises a thermally conductive material apart from the substrate, and wherein the wire mesh is arranged above and apart from a light-emitting semiconductor and the substrate;
- attaching the mesh support member to a heat sink, wherein the wire mesh is arranged in thermal contact with the heat sink via the mesh support member;
- and
- depositing at least one phosphor mixture onto the wire mesh.
3 more elements
Dependencies are inferred from the claim text.